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Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

Winsmart Electronic Co.,Ltd
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    Buy cheap Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment from wholesalers
     
    Buy cheap Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment from wholesalers
    • Buy cheap Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment from wholesalers
    • Buy cheap Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment from wholesalers

    Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

    Ask Lasest Price
    Brand Name : Winsmart
    Model Number : SMTS32
    Certification : CE
    Price : USD1-10000/Set
    Payment Terms : L/C, T/T, Western Union
    Supply Ability : 200 sets per month
    Delivery Time : 5-8 days
    • Product Details
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    Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

    SMT Assembly Equipment PCB Bonding Machine PCB Soldering Machine


    PCB Bonding Machine Applicable Area:

    LCD Module, Solar Battery, Camera , Electronic Components, Coil / Inductor, Mobile Devices, PWB, Power Devices.

    All where there need to be heated or fusing or joining or forming.


    PCB Bonding Machine Features:

    1. Unique pulse heat technology provides fastest soldering head heating.

    2. Programmable soldering temperature, heat-up rate and time duration for a wide range of products.

    3. Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.

    4. Closed Loop PID temperature control with clearly visible LED display.

    5. Soldering time can be programmable and is triggered by temperature.

    6. Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.

    7. Programmable pressure switch with LCD display for precise force control.

    8. CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.


    PCB Bonding Machine Specification:


    Machine size610×410×450mm
    Working areaMax 150*150mm
    Machine weight62Kg
    Working air pressure0.6-0.8Mpa
    Fixture quantity2
    Thermode head sizeMax 40*3mm
    Welding precisionpitch 0.2mm
    Pressing time1~99.9s
    Temperature settingsRT~500℃ tolerance ±5℃
    Welding pressure1~20Kg
    Temperature settingsTwo
    Working environment10-60℃,40%-95%
    Power supplyAC220V±10% 50HZ,2200W
    Alignment modeCCD + LCD Monitor
    Feeding modeManual
    Starting modePress start button
    Rotation PlatformCylinder control,tolerance<0.02mm

    Customers' Applications:


    Heat Bonding Paratmeter:

    Temperature range50℃ to 500℃
    Temperature accuracy±1°C
    Bond timer0-12 seconds
    Bond air pressure0.4-0.6MPa
    Pressure accuracy±0.05MPa
    Max bond force1100N

    Our Advantages:

    Our machine is completed with fine finishing in accordance with the quality standards of the industry.
    Our strict quality management system maintains the excellent performance and quality of our products.
    The product is the preferred one in the fields for its huge economic benefits.


    Delivery Terms:

    1. Ex-work/FOB/CIF/DDU, up to clients

    2. Production leadtime: 7-15 days to customized make fixtures/jigs and test it with the punching machine.


    Quality Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment for sale
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