FPC Laser PCB Depaneling Machine Clean and Precise Cutting System
Suitable Processing Materials:
1. Flexible circuit boards, rigid circuit boards, rigid-flex
circuit board sub-board processing.
2. Rigid, flexible circuit board sub-board processing component is
installed.
3. Thin copper foil, a pressure-sensitive adhesive sheet (PSA), an
acrylic film, a polyimide coating film.
4. Thickness of 0.6mm or less precision ceramic cutting, dicing;
variety of cutting the base material (silicon, ceramics, glass,
etc.)
5. Etching precision molding various functional films, an organic
film and other precision cutting.
6. Polymer: polyimide, polycarbonate, polymethyl methacrylate,
FR-4, PP, etc.
7. Functional film: gold, silver, copper, titanium, aluminum,
chromium, ITO, silicon, poly-crystalline silicon, amorphous silicon
and a metal oxide.
8. Brittle material: monocrystalline silicon, polycrystalline
silicon, ceramic and sapphire.
Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 600mmx600mm(Customizable) |
| Scanning Speed | 2500mm/s (max) |
| Working field | 40mmх40mm |
Features:
No mechanical stress
Lower tooling costs
Higher quality of cuts
No consumables
Simple software changes enable application changes
Display:
Laser PCB Depaneling Machine FAQ:
Q: What kind of PCBs are workable to use this machine?
A: FPC and FR4 panels, covering v score and tab boards.
Q: What is laser head of the machine?
A: We use USA Optowave laser.
Q: What kind of laser source you provide?
A: Green, CO2, UV and picosecond.
Q: What is cutting speed?
A: It depends on PCB material, thickness and cutting effect
requirements.
Q: Does it cause dust during cutting?
A: No dust, but smoke, machine comes with exhaust system and water
cooler
