Automatic PCB Soldering Machine Hotbar Soldering Machine for Mobile
Phone
Hot Bar Soldering Machine Features:
1. According to different products, optional temperature for your
choice.
2. Unique material thermode head, ensure the average pressure
3. Has vacuum function, easier for adjustment and positioning.
4. NC temperature, clear and high precision
5. With digital pressure gauge, pressure range can be preset.
6. Microcomputer control, high accuracy and stable.
7. Programmable curve Including pre-heating and reflow soldering
temperature.
8. Suitable for all kinds of high density TAB, TCP and pressure to
FPC, FFC and PCB soldering pressure welding.
9. Precise PID control, phase angle replace pulse drive.
10. Less Libration, less noise, avoiding voltage fluctuate
11. Real-time display temperature curve and temperature data.
12. Touch screen input data, simplify the operation.
Hot Bar Soldering Machine Principle:
The hot bar power supply provide the current to heat the thermode
which is high resistivity such as W,Mo,Ti. The temperature climb up
to a certain value to melt theTIN and the solder, when the
temperature drop down, the workpiece is connected by the TIN. A
pressure is working through all the process and the temperature is
accurately controlled by the IGBT inverter power supply.
Hot Bar Soldering Machine Specification:
| Machine size | 660×660×700mm |
| Working area | Max 200*170mm |
| Machine weight | 92Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 2 |
| Thermode head size | Max 80*5mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start buttom |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Hot Bar Soldering Machine Applications:
FFC to PCB soldering
FPC to PCB soldering
Wires to PCB soldering
HSC to PCB soldering
HSC to LCD soldering
Heat Sealing Paratmeter:
| Temperature range | 50℃ to 500℃ |
| Temperature accuracy | ±1°C |
| Bond timer | 0-12 seconds |
| Bond air pressure | 0.6-0.8MPa |
| Pressure accuracy | ±0.05MPa |
| Max bond force | 1100N |
Thermode Specification:
| Max thermode area | 340mm2 |
| Max thermode length | 80mm |
| Thermode stroke | 50mm |
| Actual type | pneumatic |
