Rigid Print Circuit Board 20W UV Laser Cutting Equipment Without
Stress
Laser Cutting Equipment Description:
The laser cutting equipment can cut various types of PCB circuit
boards with V-CUT and stamp holes, and divide the encapsulated
circuit boards and ordinary optical boards. It is suitable for
laser cutting and depaneling PCB circuit boards made of soft and
hard combination boards, FR4, PCB, FPC, fingerprint identification
module, covering film, composite materials, copper substrate and
other materials.
According to the demand, UV and green laser can be used to cut and
separate the PCB, and various types of PCB circuit boards with
V-CUT and stamp holes can be precisely cut The equipment supports
automatic loading and unloading cutting, which can realize
automation
Laser Cutting Equipment Characteristics:
1. High performance UV / green laser is adopted, with small laser
focusing spot and narrow notch.
2. The board cutting process shall be clean and free of dust to
avoid circuit failure caused by conduction caused by waste.
3. The PCB board that has been pasted can be divided directly.
There is no contact and stress during cutting.
4. High precision two axis working platform, high precision and
fast speed.
5. CCD can be used for automatic positioning and correction.
6. The processing is automatically controlled by computer software,
and the software interface gives real-time feedback to understand
the processing status in real time.
Laser Cutting Equipment Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | UV 20W |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| PCB Feeding | Manual |
| PCB Unloading | Manual |
| PCB Positioning | Fixture |
| Cutting Stress | 0 |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 600mmx600mm(Customizable) |
| Platform | Marble |
| PCB Material | FPC and FR4 |
| Gerber Import Function | Yes |
| Cutting Path | Circle, line, point, arc |
| Operation System | Win 10 |
| Scanning Speed | 2500mm/s (max) |
| Working Field | 40mmх40mm |
| Warranty | 1 year |
| Service | 24hours on-line support, oversea training is available |
| Machine Condition | 100% NEw |
Laser Cutting Equipment Applicable Industry:
It is suitable for cutting various types of PCB substrates, such as
ceramic substrates, soft and hard bonding plates, FR4, PCB, FPC,
fingerprint identification module, covering film, composite
materials, copper substrates, etc.
