Hot Bar Soldering Machine 0.2 Pin Pitch For FPC FFC PCB Soldering
Hot Bar Soldering Machine Introduction:
1. Hot press is also called bonding machine. According to the
different media of hot pressing, it can be divided into soldering,
ACF bonding machine (opposite conductive tape), ACP (opposite
conductive glue), TBF (hot melt adhesive film).
2. It is applicable to the connection of FPC (flexible circuit
board), HSC (Zebra paper), tab and LCD and PCB. As the pitch of PCB
or FPC in consumer electronic products tends to be smaller, the
traditional soldering process has been difficult to meet the
requirements of extremely fine hot pressing, so the ACF process has
been gradually applied by mobile phone designers.
Hot Bar Soldering Machine Working Principle:
Pulse heating principle: due to the special design of the welding
head surface, the resistance of the welding surface is very small,
and the current will pass through the section with the smallest
resistance. By constantly changing the voltage and adjusting the
current level, the welding head can quickly heat up. The pulse
current refers to the on and off frequency ratio of the current.
The larger the pulse ratio, the larger the current output, and the
faster the temperature rise of the welding joint.
Hot Bar Soldering Machine Features:
1. Use pulse heating technology, the temperature control is
accurate, and the temperature sampling frequency is 0.1s
2. Single working platform, rotary working platform, left and right
mobile platform and other diversified working modes
3. Multi stage temperature rise control
4. Real time temperature curve display
5. Silicone Tape indexing mechanism
6. CCD vision system provides accurate alignment
7. Large capacity program pre storage
8. Touch operation interface, program password protection
Hot Bar Soldering Machine Specification:
| Machine size | 500×500×600mm |
| Working area | Max 200*170mm |
| Machine weight | 62Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
| Thermode material | Molybdenum alloy |
| Thermode size | Max 60mm long |
| Origin | China |
| Fixing mode | Customized fixture |
| Application | FFC to PCB, FPC to PCB, Wires to PCB |
| Warranty | 12 months |
Hot Bar Soldering Machine Application Field:
1. Mobile phone manufacturer
2. Touch screen manufacturer
3. Computer
4. Printer, etc.
