Economic 15W Optowave Laser Head Flex PCB UV Laser Cutting Machine
UV Laser Cutting Machine Instroduction:
This PCB Laser Depaneling equipment is integrated with
high-stability and the best performance UV laser
generator.
This equipment delivers great working area focus, power
distribution ratio and small thermal affection that gives small
cutting width and high cutting quality during processing.
With sophisticated two-axis table and closed loop control module,
it ensures fast cutting while maintaining micron magnitude of
precision with modern technology of position sensors and CCD image
capture application.
PCB depaneling and singulation laser systems are gaining
popularity—especially as circuit board complexity and component
ratios continue to rise. Microelectronics and medical device
manufacturers require close tolerances and minimal debris—this is
where laser technology shines
UV Laser Cutting Machine Description:
Laser cutting is now being offered as an additional method by some
manufacturers.
UV laser depaneling makes use of a 355 nm wavelength (ultraviolet),
diode-pumped, laser source. At this wavelength the laser is capable
of cutting, drilling and structuring on rigid and flex circuit
substrates. The laser beam, capable of cut widths under 25μm, is
controlled by high-precision, galvo-scanning mirrors with repeat
accuracy of +/- 4 μm.
A variety of substrate materials can be cut with a UV laser source
including FR4 and FPC.
UV Laser Cutting Machine Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 300mmx300mm(Customizable) |
| Scanning Speed | 2500mm/s (max) |
| Working field | 40mmх40mm |
UV Laser Cutting Machine Advantages:
Accuracy, precision, low mechanical stress, higher quality of cuts,
lower tooling costs and flexible contour and cut capabilities.
