Non-contact Laser PCB Cutting Machine Circuit Board Laser Depaneling Machine

Laser Depaneling Machine Introduction:

Laser cutting is not being offered as an additional method by some manufacturers.

UV laser depaneling makes use of a 355 nm wavelength, diode-pumped laser source.

The laser beam capable of cut widths under 25um, is controlled by high prceision mirrors.

Laser cutting has advantages of accuracy, precison, low mechanical stress and cut capabilities.

Laser Depaneling Machine Features:

No mechanical stress

Lower tooling costs

Higher quality of cuts

No consumables

Design versatility-simple software changes enable application changes

Works with any surface-Teflon, ceramic, aluminum, brass and copper

Fiducial recognition achieves precise, clean cuts

Laser Depaneling Machine Specification:

Factory established in 2005, has built and maintained its reputation as a source of technical

and professional excellence.

Winsmart has a driven, experienced, and knowledgeable team, providing extensive array of solutions

for PCB depaneling and soldering. Above all, it takes pride in the quality and efficient service that it

provides to customers, which is reflected by long-standing relationships across a diverse customer base.

Winsmart will continue to meet customers' requirements by supplying the excellent solution with

unique technology and service!